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Facilities
Fabrication and Processing Resources
In order to provide a cost effective and practical method for device fabrication, the Micro and Nanosystems Group takes advantage of four main processing resources: the clean room facilities of ETH-Zürich, the chemical lab of the Micro and Nanosytems Group in the CLA building, commercial MEMS and microelectronic foundries and the specialized resources and process knowledge of our partners.The clean room resources utilized by the Micro and Nanosystems group include the CLA labs of the ETH Zentrum campus near the city center, which are jointly operated by IMES, IRIS and the Micro and Nanosystems Group, and the FIRST lab of the ETH Hönggerberg campus several kilometres northwest of the city.
Class 10-100 air quality is maintained for the labs with a total space of over 700 square meters. The FIRST lab is primarily designed for III-V semiconductor materials; however the equipment and material selections can be customized based on project needs. Technicians and support staff are available in both labs to ensure equipment is maintained and to assist in the process planning.
A brief list of process technology currently available in each lab is given below. For more information on each lab, using the following links: CLA Lab, FIRST Lab and BRNC.
| PROCESS | FIRST-CLA | FIRST | BRNC |
| Deposition |
Sputtering and evaporation of metals and dielectrics, CVD carbon nanotube growth |
Sputtering, evaporation, epitaxial growth: MBE, LPCVD, PECVD, MOCVD, dielectrics and III-V materials, CVD carbon nanotube growth, ALD dielectrics |
Sputtering, evaporation, thermal/PE-CVD CNT growth, CVD graphene, ALD dielectrics and metals. |
| Lithography | High quality G-line photolithography: single and double sided mask aligner | DUV photolithography, infrared backside alignment, 2x E-beam (30 kV), Nanolithography (AFM) | Photolithography: single and double sided mask aligners, nanoimprint lithography, FIB, spray coater, Laser writer, E-beam (100kV) |
|
Micro-Replication |
Hot-embossing, compression-molding |
Electroplating | |
| Etching | RIE, ICP, wet etching, and HF vapor etching | RIE, ICP, wet etching | RIE, ICP, XeF2 etcher, wet etching and HF vapor etching |
| Characterization and Analysis |
Wafer probe stations, surface profile analyzer, 2x AFM, white light interferometer, confocal micro-Raman spectroscopy, potentiostat, vibrometer |
Ellipsometer, CV profiler, PL-mapper, wafer probe station, Hall prober, X-ray, 2x SEM, AFM, (FIB, TEM and Cs-corrected STEM at EMEZ) |
SEM, AFM, surface profiler, ellipsometer, wafer probe station, FIB, TEM |
| Thermal Treatment | Tempering, oxidation, baking, drying, laser mill | RTA, oxidation, hotplates, oven | RTA, oxidation, hotplate, oven |
| Mechanical Treatment | Ultrasonic bath, dicing, glass drill, scriber, hydraulic hot press | Lapping/polishing, dicing, cleaving, scribing | Ultra and megasonic bath, dicing, |
| Packaging |
wire and wafer bonders |
wire bonding, flip-chip bonding | Wire, die/flip chip bonder, wafer anodic bonder |
| Pre/Post Processing |
Freeze dryer, plasma asher, 6" super critical CO2 dryer |
Barrel reactor | Super-critical CO2 dryer |
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